Cuprima
"Cuprima" is a trademark owned by Mitsui Kinzoku Company, Limited, filed at the WIPO on March 30, 2026. It is on file and covers classes 1 and 6.
- Status
- Mixed
- Filed
- March 30, 2026
- Registered
- Not yet
- Expires
- March 30, 2036
- Application no.
- Not recorded
- Registration no.
- 1923062
- Office
- WIPO
- World Intellectual Property Organization
- Mark type
- Trademark
- 2 classes
Who owns Cuprima
The owner on file, matched to the company behind it. Every owner-name spelling for that company is grouped on its page.
Owner
Mitsui Kinzoku Company, Limited
Japan
Representative
KONNO Akio
What the mark covers
The products and services Cuprima is filed for, grouped by Nice class.
Adhesives for use in the manufacture of electronic components; tacking agent [temporary fixing adhesives]; tacking agent, namely, temporary fixing adhesives for industrial use; temporary fixing adhesives used for electronic components; temporary fixing adhesives; fixative adhesives; fixative adhesive substances; temporary fixing adhesives for use in the manufacture of semiconductors; temporary fixing adhesives used for temporary binding semiconductor chips in assembly processes of electronic components and semiconductors; adhesives for electronic components; adhesives for semiconductors; copper-based industrial chemicals in the form of pastes used in bonding and sintering processes of electronic components; adhesives for industrial purposes; adhesive substances for use in industry; adhesive substances.
Powder of copper in the form of pastes used in bonding and sintering processes of electronic components; metals in the form of pastes used in bonding and sintering processes of electronic components; metal preforms used in bonding and sintering processes of electronic components; preformed copper used in bonding and sintering processes of electronic components; copper preforms used in bonding and sintering processes of electronic components; semi-processed copper used in bonding and sintering processes of electronic components; non-ferrous metals in the form of foils used in bonding and sintering processes of electronic components; non-ferrous metals in the form of foils; non-ferrous metals in the form of sheets; copper foils; foils of copper, foils of copper alloys; copper used as a bonding material of metal used for electronic components; powder of copper in the form of pastes used as a bonding material for electronic components such as power semiconductors; metals in the form of pastes used as a bonding material for electronic components such as power semiconductors; metal preforms used as a bonding material for electronic components such as power semiconductors; preformed copper used as a bonding material for electronic components such as power semiconductors; copper preforms used as a bonding material for electronic components such as power semiconductors; semi-processed copper used as a bonding material for electronic components such as power semiconductors; non-ferrous metals in the form of foils used as a bonding material for electronic components such as power semiconductors; non-ferrous metals in the form of sheets used as a bonding material for electronic components such as power semiconductors; copper used as a bonding material of metal used for electronic components such as power semiconductors; copper and its alloys in the form of pastes used for sintering in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for die attach in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for bonding cooling components, heat dissipation components, heatsinks, and baseplates in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for clip attach in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of sheets used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; preforms of copper and copper alloys used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; semi-processed copper and its alloys used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for die attach in manufacturing processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for bonding cooling components, heat dissipation components, heatsinks, and baseplates on printed circuit boards in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for clip attach in manufacturing processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used in sintering processes; powder of copper in the form of pastes used in sintering processes; copper foils used in sintering processes; copper and its alloys used in sintering processes; copper and its alloys in the form of pastes used for sinter joining; powder of copper in the form of pastes used for sinter joining; copper foils used for sinter joining; copper and its alloys used for sinter joining; copper and its alloys; copper and its alloys in the form of pastes; castings, foils, and rolled, drawn or extruded semi-finished articles of copper or its alloys; powder of copper in the form of pastes; conductive copper alloy particles in the form of pastes.
About Cuprima
Who owns the trademark "Cuprima"?
The WIPO trademark "Cuprima" is owned by Mitsui Kinzoku Company, Limited.
What is the status of "Cuprima"?
Its status at the WIPO is: mixed.
Get this data via the API
Everything on this page comes from the Signa API. Pull Cuprima and marks like it into your own product with one request.
GET/v1/trademarks/{id}The full record: owners, classes, dates and images
GET/v1/trademarks/{id}/eventsEvery step in the office history
GET/v1/proceedings?trademark_id={id}Oppositions and cancellations against the mark
ID=tm_d4571a9a-baf0-4150-b29d-4ff3bbaf24e5
curl https://api.signa.so/v1/trademarks/$ID \
-H "Authorization: Bearer $SIGNA_API_KEY"{
"id": "tm_d4571a9a-baf0-4150-b29d-4ff3bbaf24e5",
"object": "trademark",
"mark_text": "Cuprima",
"status": {
"primary": "mixed",
"stage": "mixed"
},
"office_code": "WO",
"application_number": null,
"filing_date": "2026-03-30",
"nice_classes": [
1,
6
],
"owners": [
{
"name": "Mitsui Kinzoku Company, Limited",
"entity_id": "ent_019eb7e1-1f48-7757-b39c-97ad20687f9f"
}
]
}