3.5 D
"3.5 D" is a trademark owned by Pac Tech - Packaging Technologies GmbH, filed at the WIPO on August 30, 2018. It is registered and covers classes 6, 7, 40 and 42.
- Status
- Registered
- Since July 7, 2020
- Filed
- August 30, 2018
- Registered
- Not yet
- Expires
- August 30, 2028
- Application no.
- Not recorded
- Registration no.
- 1448820
- Office
- WIPO
- World Intellectual Property Organization
- Mark type
- Trademark
- 4 classes
Who owns 3.5 D
The owner on file, matched to the company behind it. Every owner-name spelling for that company is grouped on its page.
Owner
Pac Tech - Packaging Technologies GmbH
Germany
Representative
Cynthia A. Moyer
Fredrikson & Byron, P.A.
What the mark covers
The products and services 3.5 D is filed for, grouped by Nice class.
Common metals and their alloys, metal materials for building and construction; transportable buildings of metal; non-electric cables and wires of common metal; metal containers for storage or transport; contact metallisations for micro joints of soldering materials, included in this class (welding and soldering materials).
Machines, machine tools and power tools for the manufacture of transponders and semiconductor wafers, and integrated circuits affixed thereto; machines, machine tools and power tools in the field of microperipheric technologies; machines, machine tools and power tools for applying connecting materials onto substrates; machines, machine tools and power tools for manufacturing micro-connections; machines, machine tools and power tools to build up substrate units composed of one substrate or several substrates combined together to form a module, in particular chips; motors and engines, other than for land vehicles; couplings and transmission components, other than for land vehicles; devices in relation to micro-peripheral technologies (machines for manufacture and processing of semi-conductors); apparatus for applying connecting materials onto substrates; apparatus for manufacturing micro-connections, in particular for building up substrate units composed of one substrate or several substrates combined together to form a module, in particular chips.
Treatment of materials in relation to substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates.
Industrial analysis and research services; design and development of computer hardware and software; development of contact pad metallisations for connection technology, development of connection technologies for the manufacture of micro-connections; technological consultancy, in particular regarding the manufacture of micro-connections.
About 3.5 D
Who owns the trademark "3.5 D"?
The WIPO trademark "3.5 D" is owned by Pac Tech - Packaging Technologies GmbH.
What is the status of "3.5 D"?
Its status at the WIPO is: registered.
Get this data via the API
Everything on this page comes from the Signa API. Pull 3.5 D and marks like it into your own product with one request.
GET/v1/trademarks/{id}The full record: owners, classes, dates and images
GET/v1/trademarks/{id}/eventsEvery step in the office history
GET/v1/proceedings?trademark_id={id}Oppositions and cancellations against the mark
ID=tm_835300e1-d365-40e5-ad13-ee76101cdf66
curl https://api.signa.so/v1/trademarks/$ID \
-H "Authorization: Bearer $SIGNA_API_KEY"{
"id": "tm_835300e1-d365-40e5-ad13-ee76101cdf66",
"object": "trademark",
"mark_text": "3.5 D",
"status": {
"primary": "active",
"stage": "registered"
},
"office_code": "WO",
"application_number": null,
"filing_date": "2018-08-30",
"nice_classes": [
6,
7,
40,
42
],
"owners": [
{
"name": "Pac Tech - Packaging Technologies GmbH",
"entity_id": "ent_019ebafe-063f-713d-8428-da49551a90e8"
}
]
}