MAKING A MATERIAL DIFFERENCE

Manufacturing machines and apparatus, namely, physical, chemical and electro technical equipment, and parts therefore, diamond like carbon systems, ion beam deposition systems and ion beam sources therefore, ion beam etch systems, physical vapor deposition systems, lapping/dicing systems, thermal deposition sources; semiconductor fabrication machines and magnetic storage fabrication machines including components therefore; manufacturing machines and apparatus, namely, molecular beam epitaxy (MBE) systems including components therefore and metal organic chemical vapor deposition (MOCVD) systems including wafer carriers and components therefore, wafer processing machines including components therefore; laser annealing systems comprised of lasers for annealing purposes including components therefore; photolithographic machines for manufacturing semiconductor wafers and other substrates including components therefore; semiconductor wafer processing machines for atomic layer deposition systems including components therefore; semiconductor wafer processing equipment; semiconductor single wafer processing machines using etch chemicals for the semiconductor industry; semiconductor single wafer wet processing machines using solvent chemicals; machines containing ion sources and ion source controllers for vacuum coating processes; molecular beam epitaxy crucibles and effusion cells for manufacturing semi-conductors and integrated circuits; heated high speed rotating disks operated under high vacuum and exposed to the flow of chemicals in the production of semiconductors; optical coating ion beam machine for coating multi-layer optical thin films including components therefore; physical vapor deposition systems, lapping/dicing systems; semiconductor fabrication machines and magnetic storage fabrication machines including components therefore; metal organic chemical vapor deposition (MOCVD) systems, wafer processing machines including components therefore; photolithographic machines for manufacturing semiconductor wafers and other substrates including components therefore; semiconductor wafer processing machines for atomic layer deposition systems including components therefore; semiconductor wafer processing equipment; semiconductor single wafer processing machines using etch chemicals for the semiconductor industry; semiconductor single wafer wet processing machines using solvent chemicals; machines containing ion sources and ion source controllers for vacuum coating processes; heated high speed rotating disks operated under high vacuum and exposed to the flow of chemicals in the production of semiconductors; optical coating ion beam machine for coating multi-layer optical thin films including components therefore.

Scientific machines and apparatus, namely, physical, chemical and electro technical equipment, and parts therefore, diamond like carbon systems, ion beam deposition systems and ion beam sources therefore, ion beam etch systems, thermal deposition sources; scientific machines and apparatus, namely, molecular beam epitaxy (MBE) systems including components therefore and including wafer carriers and components therefore; laser annealing systems comprised of lasers for annealing purposes including components therefore; gas sensors and controls for regulating gas concentrations and/or mass transfer rates in various manufacturing processes; molecular beam epitaxy crucibles and effusion cells for manufacturing semi-conductors and integrated circuits; computer control software for use in ion beam system applications through touch screen mode; gas sensors and controls for regulating gas concentrations and/or mass transfer rates in various manufacturing processes; computer control software for use in ion beam system applications through touch screen mode.